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Thick film technology - hybrid circuits

Component design and connection technology in the clean room

There is almost no alternative to the use of thick film technology, especially when it comes to the miniaturisation of electronic assemblies. Good heat conductivity and deployment under extreme environmental temperatures and conditions are also required.

Our electronics manufacturing uses thick film technology to manufacture multilayer PCBs and hybrid circuits in the clean room. Conductor paths are applied directly on ceramic substrates, aluminium substrates or glass substrates using screen printing. After a layer has dried and sintered, the process can be repeated several times. Resistors are also printed and then trimmed to the required value using a laser.

Further electronic components are assembled using SMD assembly or THT assembly, followed by soldering. When it comes to highly complex circuits, we also assemble integrated semiconductors on the substrate using chip-on-board (bonding).

Implementing your thick film hybrid circuit:

  • Ceramic substrates (Al2O3, AlN), aluminium and glass substrates
  • Conductor path printing
  • Resistor printing and laser trimming
  • DBC ceramic
  • Low-pressure sintering
  • Chip-on-board technology in ISO clean room classes 5 and 7
  • State-of-the-art and automated soldering methods
  • Product-specifictest management

Further advantages of thick film technology:

  • Components can be assembled using different manufacturing techniques
  • The substrates used are low-loss isolators that conduct power loss well
  • The printed resistors can be precisely set to the required value using laser trimming

Get in touch with us. We are happy to answer your questions about our technologies.