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Chip-on-Board assembly

High miniaturisation potential, low manufacturing costs

Chip-on-board technology is an assembly method in electronics manufacturing with high miniaturisation potential and greater complexity at comparatively low manufacturing costs. Unlike the SMD process, chip-on-board assembly requires a smaller number of connection layers. The unpackaged semiconductor chips (dies) are assembled in our clean room (ISO class 5 and 7) on ceramic or conventional FR-PCBs and then fastened to the PCB using wire bonding or using solder and/or plastic.

We use various techniques:

  • Chip-and-wire technology: The chip is glued directly onto the PCB (die bonding) and electrically connected to the PCB using wire bonding.
  • Flip-chip assembly: The chip is provided with solder balls or conductive plastic and then connected to the PCB electrically and mechanically.
  • Final assembly: The chip and its wired connections are protected by a glob-top (plastic)

Chip-on-board assembly of LEDs offers new design and technical execution possibilities, particularly in lighting technology.


  • Increased design flexibility
  • Greater energy savings
  • Improved light distribution
  • More efficient thermal management

We would be happy to provide you with information about the advantages of the chip-on-board technology.