Mechanical Packaging

SECURE FUNCTION S PERMANENTLY

Environmental impacts such as dirt, humidity, and temperature put your electronics at risk.

We master most various technologies for the optimal protection of your assemblies.

Our individual enclosure solutions combine function and design.

We competently realize connectivity with connector solutions from own production.

POTTING

Submerged

Potting is an optimal protection for your electronics.

By potting with all common materials, we achieve highest resistance to aggressive media- and mechanical stresses.

Handling is also effected as a vacuume-process.

COATING

Effective protection against humidity and dust.

Selective coating in fully automatic process provides for direct protection of sensitive PCB areas.

Fully automatic dip coating for protection of entire circuitries.

FOAMING

Light but safe.

Polyurethane foam – a low-price material with varied possibilities and slight volume weight.

Used as PU-soft foam for producing any form of captive gaskets.

Used as PU-hard foam for efficient foaming of electronic assemblies in series production.

OVERMOLD

Miniaturisation - nouvelles solutions dans la technologie du boîtier.

The direct overmolding of electronics allows for manufacturing highly tight enclosures with minimum space requirement.

The individual shaping provides for flexible enclosure adaptation to the user environment.

It minimizes assembly work through integration of mechanical fixing elements.

Hot Melt

Safe and reasonable

Hot Melt is the cost-effective alternative to formative electronics protection.

Hot Melt-Molding is a process for direct overmold of electronic assemblies in small series.

It stands out through slight mechanical- and thermal stresses of the assemblies during the overmold procedure.

Low-price tools of Aluminum can be used for shaping.

ENCLOSURE TECHNOLOGY

Plastic enclosures in various styles for your electronics.

ASSEMBLY

Put things together.

We transform electronics into assemblies and devices.

Upon request, we assemble your components up to the finished device – and packaged.