Logo EMS

EMS

PRODUCTION LIKE CLOCKWORK

Production with most modern technologies. The experience of our specialists in all production technologies of electronics, enclosures, and connectivity guarantee highest quality and efficiency. Satisfied customers e.g. in the fields of automotive-, medical-, and drive technologies provide the evidence.

We accompany your product in our production from prototype on to zero series and series production.

PICK AND PLACE

Components as swift as an arrow.
State-of-the-art assembly

  • SMD- pick and place
    0201, BGA, µBGA, QFP, Fine- Pitch
    Interlinked systems with reflow-soldering also in lead-free process.
  • THT- pick and place
    Processing by wave-soldering, selective soldering systems and soldering robots (lead-free with nitrogen available).

COB

Competence even with little things.
Processing Bare Dies with subsequent thin- or thick-wire bonding.

  • Multichip Die Bonding
  • Thermo- and Ultrasonic Wire Bonding
  • Diverse bonding- and Glob Top-technologies
  • Diverse bonding- and Glob Top-technologies

HYBRID TECHNOLOGY

For special requirements.
A special technology for special tasks. Building conductor paths and integrated components on ceramic substrates by screen printing and sinter technology for several layers as well. Further handling with standard processing such as SMT and COB.

LOGISTICS

Minimize effort.
We take over the entire material procurement for your production including shipping logistics up to your end customer.

PACKAGING

Protection for the journey
We also have individual packaging solutions for every requirement.

  • Industrial returnable packaging
  • ESD-worthy packaging
  • Brand labeling with documentation for end-customer sales packaging on request

LASER TRIMMING

Cuts with effect.
We achieve precision down to detail – trimming with YAG- lasers.

  • Active calibration of sensors
  • Active trimming of circuit functions
  • Laser trimming of thick-film resistors
  • Laser trimming of SMD resistors

MARKING

Point the way.
Electronic assemblies and finished devices must often be marked.
We do marking with:

  • Ink-jet
  • Pad-printing
  • Laser-printing systems
  • Labeling

TESTING

Quality assurance in each production step.
Numerous testing possibilities are available at final testing and during production:

  • 100% functional test according to customer specification
  • Statistical process control with TURCK-Test-System as well as evaluation and documentation on request
  • Visual testing systems and AOI
  • Paste testing systems
  • Flying Probe and In-Circuit-Test
  • Bond Pull- and shearing-test
  • Testing systems for radio applications
  • Further tests according to customer specifications possible